Advanced Microsystems for Automotive Applications Yearbook by R. H. Grace (auth.), Sven Krueger, Wolfgang Gessner (eds.)

By R. H. Grace (auth.), Sven Krueger, Wolfgang Gessner (eds.)

Microsystems are a massive luck consider the auto undefined. in an effort to fulfil the shoppers requests for safeguard comfort and motor vehicle financial system, and to meet environmental standards, microsystems have gotten imperative. hence a good number of microsystem functions got here into the dialogue. With the foreign convention AMAA 2002, VDI/VDE-IT offers a platform for the dialogue of all MST appropriate parts for automobile functions. The convention complaints assemble the papers by way of authors from vehicle providers and manufacturers.

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Members are R. Wechsung, F. Goetz, H. Wicht, JC Eloy, A. EI Fatatry, F. d. Weijer, G. Tschulena, M. lIIing, R. Lawes, H. de. 3 Automotive Micro and Nano-Technology in the Sixth Framework Programme T. 1 Introduction Micro and Nano-Technology is very wide ranging, covering a variety of disciplines, topics and activities at different stages of the development. 4 lines of activities (see Fig. 1) are of major concern in the next Framework (FP6) of European Research: micro- and nano-electronics oriented towards further shrinking semiconductors technology and/or to provide solutions below 20 nm for processing, computing and communication devices, memory / storage devices and for further system integration; micro-nano-technologies as a concept for further integration and miniaturisation of sensing and actuating and to bring intelligence and networking in products and in their interfacing with the surroundings; nano-science and nano-technology as the ability to manipulate at molecular level to create new structures, materials, processes; nano-bio-technology and nano-chemistry These lines of activities are building upon long term research on generic nano-technologies with generic application potential and on research for equipment, instrumentation and production techniques.

At the end of the process run, these sacrificial layers are removed leaving the desired 3D structures on the wafer surface. ------F~. ,,-~ qs~ . Fig. 5. Principle Schematic of Surface Micromachined Structures Conclusion The choice of 3D-micromachining technology depends strongly on the application field and design of the MEMS product to be manufactured. Cost considerations usually strongly favour the cheap KOH wet etching process allowing batch processing of large quantities of wafers. Nevertheless, surface micromachined pressure sensors or gyroscopes as well as a number of acceleration sensors have achieved good commercial success.

Recent years have also shown the upcoming of a new generation of Deep Reactive Ion Etching processes and equipment (DRIE) which allows the etching of deep trenches with high aspect ratio with low underetching. The "Bosch process" is amongst the most commonly used process for DRIE. Anisotropic Etching Anisotropic etching process exhibit a strongly varying etch rate with crystal orientation of single crystal semiconductor material. They are bases for the majority of micromechanical devices and structures.

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